البريد الإلكتروني: [email protected]

4004 laser cutting

Common raw materials

Forging display

CNC processing

The effect of laser parameters on the angular cleaning of

2022121 · A dramatic cleaning of AL- 4004 surfaces removed the oxidation layer using the angular laser cleaning. The cleaning at angle 20° with power 10 W and hatch

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Laser slicing of 4H-SiC wafers based on picosecond laser

2022101 · A wheel cutter (Disco DFD641) cut the wafer to 1 cm × 1 cm. The picosecond laser used in the experiment was developed by our group. The parameters of

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Laser Cutting_